Company to Demonstrate Wide-Ranging Lineup of Memory and Storage
Solutions, Introduce New Series of SSDs for Ultra-Thin Notebook Designs

LAS VEGAS–(BUSINESS WIRE)–This week at CES®
2019
, Toshiba
Memory America, Inc.
(TMA), the U.S.-based subsidiary of Toshiba
Memory Corporation, will be on hand to highlight its BiCS FLASH™ 3D
technology – and the role it plays in the company’s latest flash memory,
UFS, solid state drive (SSD), and KumoScale™ software products. TMA will
also leverage CES as a stage to debut the fourth generation of its
single-package ball grid array (BGA) SSD product line: the BG4 series.


Making its public debut at CES, TMA’s BG4 series – a new lineup of
ultra-compact, single-package NVMe™ SSDs – places both the flash and
controller in one package, bringing flexibility to the design of
ultra-thin notebooks, embedded systems and boot storage applications for
servers and data centers. The BG4 series leverages TMA’s innovative 96-layer
BiCS FLASH.

“Although we have been recognized as the inventor of flash memory and
the first to introduce the concept of 3D flash memory, we are not
content to simply rest on our laurels,” noted Scott Nelson, senior vice
president and general manager of Toshiba Memory America, Inc.’s Memory
Business Unit. “We continue to refine and push the technology forward in
order to address data storage challenges. This approach has made us one
of the world’s largest flash memory suppliers and has enabled us to lead
the way forward in the migration from floating gate to 3D and 96-layer
BiCS FLASH QLC (quadruple-level-cell). We are also helping to chart the
path forward in areas such as virtual reality, automotive infotainment,
artificial intelligence, technology, and more.”

Demonstrations are located in Toshiba Memory America’s private demo
suite at The Venetian® Resort (Toscana 3704) from January 8 –
11, and include:

  • BG4 series of ultra-compact, single-package NVMe SSDs
  • Enterprise,
    Client
    and Data
    Center
    SSDs
  • KumoScale
    software
  • Qualcomm® Snapdragon™845 Mobile Development
    Platform with Toshiba UFS
  • Qualcomm Snapdragon 820A Automotive Development Platform with Toshiba
    UFS

For more information, please visit business.toshiba-memory.com

Notes:

NVMe, NVM Express, and NVMe-oF are trademarks of NVM Express, Inc.
Qualcomm
Snapdragon is a trademark of Qualcomm Incorporated.
Qualcomm is a
registered trademark of Qualcomm Incorporated.
All company names,
product names and service names may be trademarks of their respective
companies.

About Toshiba Memory America, Inc.

Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba
Memory Corporation
, a leading worldwide supplier of flash
memory
and solid
state drives (SSDs)
. From the invention of flash memory to today’s
breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to
lead innovation and move the industry forward. For more information on
Toshiba Memory, please visit business.toshiba-memory.com.

© 2018 Toshiba Memory America, Inc. All rights reserved. Information in
this press release, including product pricing and specifications,
content of services, and contact information is current and believed to
be accurate on the date of the announcement, but is subject to change
without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product
specifications.

Contacts

MEDIA CONTACT:
Justine Houston-Brown
Lages & Associates
Tel.:
(949) 453-8080
justine@lages.com

COMPANY CONTACT:
Mia Cool
Toshiba Memory America, Inc.
Tel.:
(408) 526-3087
mia.cool@taec.toshiba.com

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